Specification Comparison Table
The Mediatek Dimensity 7200 vs Snapdragon 8 Gen 2 Specification Comparison – These are two processors from Qualcomm and Mediatek known for their exceptional performance and efficiency.
In this article, we’ll be comparing the Qualcomm Snapdragon 8 Gen 2 Vs Dimensity 7200, highlighting their similarities and differences in terms of features, performance, benchmark score, and other key aspects. Whether you’re a tech enthusiast, a gamer, or a business professional, understanding these differences will help you make an informed decision when choosing your next smartphone or device.
You can also check its ranking in the Best Mobile Processor Ranking List. You Can Also Check Our Processor Comparison Tool, where you can compare any Processor to anyone.
Mediatek Dimensity 7200 | Snapdragon 8 Gen 2 |
---|---|
Price is low | Better Geekbench Score |
Higher GPU frequency (~66%) | AnTuTu 9 score – 1289K vs 619K |
14% higher CPU clock speed (3200 vs 2800 MHz) | |
Snapdragon 8 Gen 2 is a better processor because it is the flagship processor from Qualcomm and the Dimensity 7200 is a midrange processor. But still, Dimensity 7200 is a very powerful processor and a great choice for a midrange smartphone.
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Product Name |
Mediatek Dimensity 7200Qualcomm Snapdragon 8 Gen 2 |
Product Image |
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Price | |
Our Rating | |
Brand | Mediatek Qualcomm |
Category | Processor Processor |
Manufacturer | Mediatek Qualcomm |
Announced | 16 February, 2023 15 November, 2022 |
Model | Dimensity 7200 SM8550-AB |
Class | Mid-range Flagship |
Size | 4nm TSMC 2nd Gen 4nm |
Cores | 8 8 |
CPU Configuration | 2x Arm Cortex-A715 up to 2.8GHz and 6x Arm Cortex-A510 1 Prime core x 3.2 GHz ARM Cortex-X3 & 4 x 2.8 GHz Cortex-A715 and 3x2.0 GHz Cortex-A510 |
High Frequency | 2800 MHz 3200 MHz |
Performance Core | 2x Arm Cortex-A715 up to 2.8GHz 1 Prime core x 3.2 GHz ARM Cortex-X3 |
Power Efficient Core | 6x Arm Cortex-A510 3x2.0 GHz Cortex-A510 |
Core architecture | hybrid (big.LITTLE) hybrid (Prime / big.LITTLE) |
Instruction set | 2nd Gen Armv9 ARMv9-A |
L2 cache | 1 MB |
L3 cache | 8 MB |
Thermal Design Power (TDP) | - |
Storage Type | UFS 3.1 UFS 4.0 |
GPU | ARM Mali-G610 MC4 Adreno 740 |
GPU frequency | 1.00 GHz |
GPU Architecture | Valhall 3 Adreno 700 |
FLOPS | 3000 |
OpenCL Version | 2.0 2.0 |
DirectX Support | 12 12 |
Vulkan version | 1.1 1.3 |
Video Encoding |
H.264, HEVC Hybrid Log Gamma (HLG), HDR10+, AV1, H.264 (Advanced Video Coding (AVC)), VP9, VP8, Dolby Vision®, H.265 (High Efficiency Video Coding (HEVC)), HDR10 |
Video Playback |
H.264, HEVC, VP-9, AV1 Up to 8K @ 60 fps |
Gaming | MediaTek’s HyperEngine 5.0 gaming HDR gaming (10-bit color depth, Rec. 2020 color gamut) • Snapdragon Shadow Denoiser |
APU / NPU / AI Proc. / Neural IP | MediaTek APU 650 Qualcomm® Hexagon™ Processor |
TOPS Speed | - |
Extra Feature |
- First Snapdragon Mobile Platform with hardware-based micro tile inferencing to run complex neural networks - Dual-core AI processor, Always-sensing camera - Qualcomm® Hexagon™ Processor Features: Qualcomm® Hexagon™ Tensor Accelerator, Dedicated power delivery system, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Micro Tile Inferencing, Fused AI Accelerator architecture, Hexagon Direct Link |
RAM Type | LPDDR5 / LPDDR4 LPDDR5x |
RAM frequency | 2133 MHz 4200 MHz |
RAM Max | 16 GB 24 GB |
Max Bandwidth | 51.2 against 64 Gbit/s |
Bus Speed | 2x 16 Bit 4x 16 Bit |
Cellular Modem | Mediatek 5G Modem Snapdragonâ„¢ X70 5G Modem-RF System |
Cellular Technology |
Sub-6GHz (FR1) up to 2CC (200MHz), NR TDD/FDD, 3GPP R16 Dual 5G SIM (5G SA + 5G SA) & Dual VoNR MediaTek 5G UltraSave 2.0 TD-SCDMA, HSPA, sub-6 GHz, FDD, 5G mmWave, NSA (non-standalone), CDMA 1x, EN-DC, EV-DO, CBRS, NR-DC (mmWave-sub6 dual connectivity), TDD, LTE, GSM/EDGE, SA (standalone), SA (standalone) mmWave, WCDMA |
5G Modem | |
5G Network | Sub-6GHz (FR1) up to 2CC (200MHz), NR TDD/FDD, 3GPP R16 8 carriers (mmWave), 2x2 MIMO (mmWave), 4x4 MIMO (Sub-6) |
5G mmWave | |
5G sub-6 GHz | |
Download Speed | 4.7Gbps Up to 10 Gbps |
Upload Speed | Up to 3.5 Gbps |
Dual SIM | |
Extra Feature |
Dual SIM Dual Active (DSDA) 5G+5G and 5G+4G, Global 5G Multi-SIM Qualcomm® Smart Transmit 3.0 technology, Qualcomm® AI-Enhanced Signal Boost, Qualcomm® 5G Ultra-Low Latency Suite, Qualcomm® Wideband Envelope Tracking, Qualcomm® 5G AI Suite, Qualcomm® 5G PowerSave Gen 3 |
wireless System | Mediatek Wireless System Qualcomm® FastConnect™ 7800 |
Wi-Fi Band | Wi-Fi 6E 2x2 (6/5/2.4GHz) 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, 802.11ax, 802.11be, 6 GHz, 2.4 GHz, 5 GHz |
WiFi-5 | |
WiFi-6 | |
WiFi-6E | |
Wi-Fi 7 | |
Download Speed | Up to 5.8 Gbps |
Bluetooth | Bluetooth® 5.3 Bluetooth® 5.3 |
GPS | GPS L1CA+L5 / BeiDou B1I+ B2a + B1C / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC GLONASS, NavIC, Beidou, GPS, QZSS, Galileo |
USB | USB-C, USB 3.1 USB-C, USB 3.1 |
NFC | |
Extra Feature |
Features: Passpoint, TDLS, High Band Simultaneous (HBS) Multi-Link, Wi-Fi QoS Management, Wi-Fi Optimized Connectivity, MU-MIMO (UL/DL), Wi-Fi Aware R3, Wi-Fi Location, OFDMA (UL/DL), Miracast, Voice-Enterprise |
ISP | MediaTek Imagiq 765 Qualcomm® Spectra™ |
Single Camera | Up to 200MP Up to 108 MP |
Multi Camera |
32MP + 32MP Dual Camera
Triple Camera (MFNR, ZSL, 30 fps): Up to 36 MP Dual Camera (MFNR, ZSL, 30 fps): Up to 64+36 MP |
Video capture |
4K HDR video capture Up to 8K HDR 30fps or 4K 120fps, 720p @ 960 fps Hybrid Log Gamma (HLG), Dolby Vision®, HDR10, HDR10+ |
Video Codec | H.264, H.265, AV1, VP9 Dolby Vision, HDR10+, HDR10, HLG, H.264 (AVC), H.265 (HEVC), VP8, VP9 |
Extra Feature | • Up to 200 Megapixel Photo Capture |
Display Support | Full HD+ 4K @ 60 Hz • QHD+ @ 144 Hz |
Refresh Rate | 144 Hz 144 Hz |
Extra Feature |
10-bit color depth, Rec. 2020 color gamut • HDR10, HDR10+, HDR vivid, and Dolby Vision |
Audio Playback | AAC, AIFF, CAF, MP3, MP4, WAV Qualcomm Aqsticâ„¢ audio codec Qualcomm Aqsticâ„¢ audio codec |
Bluetooth Audio | Bluetooth audio: Snapdragon Sound™ Technology with support for Qualcomm® aptX™ Voice, aptX Lossless, aptX Adaptive, and LE Audio |
Security Features |
Fingerprint and Face Unlock
Qualcomm® 3D Sonic Sensor Max, Qualcomm® 3D Sonic Sensor Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Voice), Biometric Authentication (Iris) |
Fingerprint Sensor | |
Face Detection |
Charging Speed | Qualcomm® Quick Charge™ 5 technology |
AnTuTu benchmark scores | 802255 1245135 |
Geekbench scores |
Single-Core Score - 856 Multi-Core Score - 2313 Single-Core Score - 1498 Multi-Core Score - 4981 |
3DMark | 13243 |
PCMark | 18915 |